The new GrindStar® equipment system for
ultra-shallow post-harvest management
Features of the GrindStar® during ultra-shallow, full-surface processing of crop residues
Ultra-shallow, full-surface cultivation of the soil and crop residues to a working depth of 0 to 2 cm, which stimulates active surface rotting
The crumb structure of the soil is disturbed as little as possible by this gentle tillage method
Smear layers or smearing of water-bearing pores/earthworm burrows are largely avoided
Ultra-shallow tillage maintains soil cover; organic material is deposited on the soil surface
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